European Packaging for highly Integrated Circuits for Reliable Electronics (EPICURE)
Call “Research Actions”, Topic “Packaging Technologies for critical defence components” – SELECTED PROJECTS EUROPEAN DEFENCE FUND (EDF) 2022
Contract n. 101121426 – CUP E53C22003010006
EPICURE aims to develop Outsourced Semiconductor Assembly and Test services (OSAT) and support technology providers in Europe in the field of advanced packaging serving defence needs. The project will analyse use-cases requirements and constraints and combine these towards modular architectures based on future chiplets. Five technology demonstrators will be designed, manufactured and tested to prequalify a “packaging toolbox” that will be built during the project.
Members of the Consortium:
- THALES SIX GTS FRANCE SAS (Coordinator)
- CHALMERS TEKNISKA HOGSKOLA AB
- ELETTRONICA SPA
- EXTOLL GMBH
- FORSVARETS FORSKNINGINSTITUTT
- FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
- HENSOLDT SENSORS GMBH
- INDRA SISTEMAS SA
- KONGSBERG DEFENCE & AEROSPACE AS
- LEONARDO -SOCIETA PER AZIONI
- NAMMO RAUFOSS AS
- SAAB AKTIEBOLAG
- SAFRAN ELECTRONICS & DEFENSE
- SINTEF AS
- SYNERGIE CAD PSC
- UNITED MONOLITHIC SEMICONDUCTORS SAS
- UNITED MONOLITHIC SEMICONDUCTORS GMBH
- UNIVERSITA DEGLI STUDI DI PAVIA
- UNIVERSITA DEGLI STUDI DI ROMA TOR VERGATA